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HEDIF TECHNOLOGY CO., LTD.

HEDIF TECHNOLOGY CO., LTD.是一家China Taiwan的公司，位于No.15, Alley 34, Lane 145, Sec. 3, Ming Chi Rd., Tai-Shan Hsiang Taipei Hsien, 24354 Taiwan。 更多详细信息如下。

公司信息

  • 公司名称: HEDIF TECHNOLOGY CO., LTD.
  • 地址: No.15, Alley 34, Lane 145, Sec. 3, Ming Chi Rd., Tai-Shan Hsiang Taipei Hsien, 24354 Taiwan
  • 国际区号: 886
  • 电话: 886-2-29043900
  • 传真: 886-2-29045696
  • 电子邮件: [email protected]
  • 网站:
  • 产品列表: Hedif offers a variety of cPCI systems,aTCA systems, backplanes and accessories. All of our products are based on the PICMG CompactPCI standards as well as IEEE 1101.10.11 Euro-card and EMI shielding requirements.Our main products include modular chassis, embedded hardware, application-specific technology, custom-engineered solutions and the other PDA holder, TV holder, connector, cable and IDC Flat cable assemblies, etc. Our 19' Modular chassis provides an economical platform for packaging rack-mount CompactPCI applications. The chassis will accept 3U or 6U cards mounted vertically or horizontally. Engineered for cooling the chassis system is available with either bottom to top or front to rear airflow.Technical Specifications # Aluminum sub-rack and panels chromate surfaces.# Rapid assembly.# EMC construction and EMC panels.# (1U~13U) (H) x 84T (W) x 285 (D) m / m.# Easy access to internal installations.# Meet IEEE1101.10 and compact PCI standard.# ISO 9001 certified. emc front panels, front cross rail, extrusion machine, rear cross rail, center cross rail, guide cross rail, front flange, rear flange, tapped strip, insulation strip, Hedif Technology
  • 员工人数: 5 ~ 10
  • 资本: USD 31,250
  • 类型: OEM Manufacturer ODM Manufacturer Exporter/Agent
  • 创办年份: 2003
  • 出口市场: World Wide
  • 配置档案: Hedif offers a variety of cPCI systems,aTCA systems, backplanes and accessories. All of our products are based on the PICMG CompactPCI standards as well as IEEE 1101.10.11 Euro-card and EMI shielding requirements.Our main products include modular chassis, embedded hardware, application-specific technology, custom-engineered solutions and the other PDA holder, TV holder, connector, cable and IDC Flat cable assemblies, etc. Our 19' Modular chassis provides an economical platform for packaging rack-mount CompactPCI applications. The chassis will accept 3U or 6U cards mounted vertically or horizontally. Engineered for cooling the chassis system is available with either bottom to top or front to rear airflow.Technical Specifications # Aluminum sub-rack and panels chromate surfaces.# Rapid assembly.# EMC construction and EMC panels.# (1U~13U) (H) x 84T (W) x 285 (D) m / m.# Easy access to internal installations.# Meet IEEE1101.10 and compact PCI standard.# ISO 9001 certified. emc front panels, front cross rail, extrusion machine, rear cross rail, center cross rail, guide cross rail, front flange, rear flange, tapped strip, insulation strip, Hedif Technology
更多链接

  • HECO-TECH ENTERPRISE CO., LTD.
  • HECTOS LTD.
  • HEDIF TECHNOLOGY CO., LTD.
  • HEDO INDUSTRY CORP.
  • HEEDFUL INTERNATIONAL CO., LTD.

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