You are here

Home

HEDIF TECHNOLOGY CO., LTD.

HEDIF TECHNOLOGY CO., LTD. is a China Taiwan company, located in No.15, Alley 34, Lane 145, Sec. 3, Ming Chi Rd., Tai-Shan Hsiang Taipei Hsien, 24354 Taiwan. more detail is as below.

Company Information

  • Company Name: HEDIF TECHNOLOGY CO., LTD.
  • Address: No.15, Alley 34, Lane 145, Sec. 3, Ming Chi Rd., Tai-Shan Hsiang Taipei Hsien, 24354 Taiwan
  • International Area Code: 886
  • Phone: 886-2-29043900
  • Fax: 886-2-29045696
  • Email: [email protected]
  • Website:
  • Product List: Hedif offers a variety of cPCI systems,aTCA systems, backplanes and accessories. All of our products are based on the PICMG CompactPCI standards as well as IEEE 1101.10.11 Euro-card and EMI shielding requirements.Our main products include modular chassis, embedded hardware, application-specific technology, custom-engineered solutions and the other PDA holder, TV holder, connector, cable and IDC Flat cable assemblies, etc. Our 19' Modular chassis provides an economical platform for packaging rack-mount CompactPCI applications. The chassis will accept 3U or 6U cards mounted vertically or horizontally. Engineered for cooling the chassis system is available with either bottom to top or front to rear airflow.Technical Specifications # Aluminum sub-rack and panels chromate surfaces.# Rapid assembly.# EMC construction and EMC panels.# (1U~13U) (H) x 84T (W) x 285 (D) m / m.# Easy access to internal installations.# Meet IEEE1101.10 and compact PCI standard.# ISO 9001 certified. emc front panels, front cross rail, extrusion machine, rear cross rail, center cross rail, guide cross rail, front flange, rear flange, tapped strip, insulation strip, Hedif Technology
  • Employees: 5 ~ 10
  • Capital: USD 31,250
  • Type: OEM Manufacturer ODM Manufacturer Exporter/Agent
  • Year of Establish: 2003
  • Export Market: World Wide
  • Profile: Hedif offers a variety of cPCI systems,aTCA systems, backplanes and accessories. All of our products are based on the PICMG CompactPCI standards as well as IEEE 1101.10.11 Euro-card and EMI shielding requirements.Our main products include modular chassis, embedded hardware, application-specific technology, custom-engineered solutions and the other PDA holder, TV holder, connector, cable and IDC Flat cable assemblies, etc. Our 19' Modular chassis provides an economical platform for packaging rack-mount CompactPCI applications. The chassis will accept 3U or 6U cards mounted vertically or horizontally. Engineered for cooling the chassis system is available with either bottom to top or front to rear airflow.Technical Specifications # Aluminum sub-rack and panels chromate surfaces.# Rapid assembly.# EMC construction and EMC panels.# (1U~13U) (H) x 84T (W) x 285 (D) m / m.# Easy access to internal installations.# Meet IEEE1101.10 and compact PCI standard.# ISO 9001 certified. emc front panels, front cross rail, extrusion machine, rear cross rail, center cross rail, guide cross rail, front flange, rear flange, tapped strip, insulation strip, Hedif Technology
More Links

  • HECO-TECH ENTERPRISE CO., LTD.
  • HECTOS LTD.
  • HEDIF TECHNOLOGY CO., LTD.
  • HEDO INDUSTRY CORP.
  • HEEDFUL INTERNATIONAL CO., LTD.

    •         ‹ previous | next ›