현재 위치

HEDIF TECHNOLOGY CO., LTD.

HEDIF TECHNOLOGY CO., LTD. 은 China Taiwan 회사로, No.15, Alley 34, Lane 145, Sec. 3, Ming Chi Rd., Tai-Shan Hsiang Taipei Hsien, 24354 Taiwan 에 위치해 있습니다. 자세한 내용은 다음과 같다.

기업 정보

  • 회사 명: HEDIF TECHNOLOGY CO., LTD.
  • 주소: No.15, Alley 34, Lane 145, Sec. 3, Ming Chi Rd., Tai-Shan Hsiang Taipei Hsien, 24354 Taiwan
  • 국제 코드: 886
  • 전화: 886-2-29043900
  • 팩스: 886-2-29045696
  • 이메일: [email protected]
  • 웹 사이트:
  • 제품 목록: Hedif offers a variety of cPCI systems,aTCA systems, backplanes and accessories. All of our products are based on the PICMG CompactPCI standards as well as IEEE 1101.10.11 Euro-card and EMI shielding requirements.Our main products include modular chassis, embedded hardware, application-specific technology, custom-engineered solutions and the other PDA holder, TV holder, connector, cable and IDC Flat cable assemblies, etc. Our 19' Modular chassis provides an economical platform for packaging rack-mount CompactPCI applications. The chassis will accept 3U or 6U cards mounted vertically or horizontally. Engineered for cooling the chassis system is available with either bottom to top or front to rear airflow.Technical Specifications # Aluminum sub-rack and panels chromate surfaces.# Rapid assembly.# EMC construction and EMC panels.# (1U~13U) (H) x 84T (W) x 285 (D) m / m.# Easy access to internal installations.# Meet IEEE1101.10 and compact PCI standard.# ISO 9001 certified. emc front panels, front cross rail, extrusion machine, rear cross rail, center cross rail, guide cross rail, front flange, rear flange, tapped strip, insulation strip, Hedif Technology
  • 직원 수: 5 ~ 10
  • 자본: USD 31,250
  • 종류: OEM Manufacturer ODM Manufacturer Exporter/Agent
  • 설립 연도: 2003
  • 수출 시장: World Wide
  • 프로필: Hedif offers a variety of cPCI systems,aTCA systems, backplanes and accessories. All of our products are based on the PICMG CompactPCI standards as well as IEEE 1101.10.11 Euro-card and EMI shielding requirements.Our main products include modular chassis, embedded hardware, application-specific technology, custom-engineered solutions and the other PDA holder, TV holder, connector, cable and IDC Flat cable assemblies, etc. Our 19' Modular chassis provides an economical platform for packaging rack-mount CompactPCI applications. The chassis will accept 3U or 6U cards mounted vertically or horizontally. Engineered for cooling the chassis system is available with either bottom to top or front to rear airflow.Technical Specifications # Aluminum sub-rack and panels chromate surfaces.# Rapid assembly.# EMC construction and EMC panels.# (1U~13U) (H) x 84T (W) x 285 (D) m / m.# Easy access to internal installations.# Meet IEEE1101.10 and compact PCI standard.# ISO 9001 certified. emc front panels, front cross rail, extrusion machine, rear cross rail, center cross rail, guide cross rail, front flange, rear flange, tapped strip, insulation strip, Hedif Technology
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