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HEDIF TECHNOLOGY CO., LTD.

HEDIF TECHNOLOGY CO., LTD.はChina Taiwanの会社で、No.15, Alley 34, Lane 145, Sec. 3, Ming Chi Rd., Tai-Shan Hsiang Taipei Hsien, 24354 Taiwanに位置する。 もっと詳しくは以下のとおりである。

会社情報

  • 会社名: HEDIF TECHNOLOGY CO., LTD.
  • アドレス: No.15, Alley 34, Lane 145, Sec. 3, Ming Chi Rd., Tai-Shan Hsiang Taipei Hsien, 24354 Taiwan
  • 国際エリアコード: 886
  • 電話: 886-2-29043900
  • ファックス: 886-2-29045696
  • メール: [email protected]
  • ウェブサイト:
  • 商品リスト: Hedif offers a variety of cPCI systems,aTCA systems, backplanes and accessories. All of our products are based on the PICMG CompactPCI standards as well as IEEE 1101.10.11 Euro-card and EMI shielding requirements.Our main products include modular chassis, embedded hardware, application-specific technology, custom-engineered solutions and the other PDA holder, TV holder, connector, cable and IDC Flat cable assemblies, etc. Our 19' Modular chassis provides an economical platform for packaging rack-mount CompactPCI applications. The chassis will accept 3U or 6U cards mounted vertically or horizontally. Engineered for cooling the chassis system is available with either bottom to top or front to rear airflow.Technical Specifications # Aluminum sub-rack and panels chromate surfaces.# Rapid assembly.# EMC construction and EMC panels.# (1U~13U) (H) x 84T (W) x 285 (D) m / m.# Easy access to internal installations.# Meet IEEE1101.10 and compact PCI standard.# ISO 9001 certified. emc front panels, front cross rail, extrusion machine, rear cross rail, center cross rail, guide cross rail, front flange, rear flange, tapped strip, insulation strip, Hedif Technology
  • 従業員数: 5 ~ 10
  • 資本: USD 31,250
  • タイプ: OEM Manufacturer ODM Manufacturer Exporter/Agent
  • 設立年: 2003
  • 輸出市場: World Wide
  • プロフィール: Hedif offers a variety of cPCI systems,aTCA systems, backplanes and accessories. All of our products are based on the PICMG CompactPCI standards as well as IEEE 1101.10.11 Euro-card and EMI shielding requirements.Our main products include modular chassis, embedded hardware, application-specific technology, custom-engineered solutions and the other PDA holder, TV holder, connector, cable and IDC Flat cable assemblies, etc. Our 19' Modular chassis provides an economical platform for packaging rack-mount CompactPCI applications. The chassis will accept 3U or 6U cards mounted vertically or horizontally. Engineered for cooling the chassis system is available with either bottom to top or front to rear airflow.Technical Specifications # Aluminum sub-rack and panels chromate surfaces.# Rapid assembly.# EMC construction and EMC panels.# (1U~13U) (H) x 84T (W) x 285 (D) m / m.# Easy access to internal installations.# Meet IEEE1101.10 and compact PCI standard.# ISO 9001 certified. emc front panels, front cross rail, extrusion machine, rear cross rail, center cross rail, guide cross rail, front flange, rear flange, tapped strip, insulation strip, Hedif Technology
その他のリンク

  • HECO-TECH ENTERPRISE CO., LTD.
  • HECTOS LTD.
  • HEDIF TECHNOLOGY CO., LTD.
  • HEDO INDUSTRY CORP.
  • HEEDFUL INTERNATIONAL CO., LTD.

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