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HEDIF TECHNOLOGY CO., LTD.

إنها HEDIF TECHNOLOGY CO., LTD. هي شركة واحدةChina Taiwan، وتقعNo.15, Alley 34, Lane 145, Sec. 3, Ming Chi Rd., Tai-Shan Hsiang Taipei Hsien, 24354 Taiwan . مزيد من التفاصيل هي على النحو التالي.

معلومات عن الشركة

  • اسم الشركة: HEDIF TECHNOLOGY CO., LTD.
  • عنوان: No.15, Alley 34, Lane 145, Sec. 3, Ming Chi Rd., Tai-Shan Hsiang Taipei Hsien, 24354 Taiwan
  • رمز المنطقة الدولية: 886
  • هاتف: 886-2-29043900
  • بالفاكس: 886-2-29045696
  • البريد الإلكتروني: [email protected]
  • الموقع:
  • قائمة المنتجات: Hedif offers a variety of cPCI systems,aTCA systems, backplanes and accessories. All of our products are based on the PICMG CompactPCI standards as well as IEEE 1101.10.11 Euro-card and EMI shielding requirements.Our main products include modular chassis, embedded hardware, application-specific technology, custom-engineered solutions and the other PDA holder, TV holder, connector, cable and IDC Flat cable assemblies, etc. Our 19' Modular chassis provides an economical platform for packaging rack-mount CompactPCI applications. The chassis will accept 3U or 6U cards mounted vertically or horizontally. Engineered for cooling the chassis system is available with either bottom to top or front to rear airflow.Technical Specifications # Aluminum sub-rack and panels chromate surfaces.# Rapid assembly.# EMC construction and EMC panels.# (1U~13U) (H) x 84T (W) x 285 (D) m / m.# Easy access to internal installations.# Meet IEEE1101.10 and compact PCI standard.# ISO 9001 certified. emc front panels, front cross rail, extrusion machine, rear cross rail, center cross rail, guide cross rail, front flange, rear flange, tapped strip, insulation strip, Hedif Technology
  • عدد الموظفين: 5 ~ 10
  • رأسمال: USD 31,250
  • النوع: OEM Manufacturer ODM Manufacturer Exporter/Agent
  • سنة التأسيس: 2003
  • سوق التصدير: World Wide
  • ملفات المستخدمين: Hedif offers a variety of cPCI systems,aTCA systems, backplanes and accessories. All of our products are based on the PICMG CompactPCI standards as well as IEEE 1101.10.11 Euro-card and EMI shielding requirements.Our main products include modular chassis, embedded hardware, application-specific technology, custom-engineered solutions and the other PDA holder, TV holder, connector, cable and IDC Flat cable assemblies, etc. Our 19' Modular chassis provides an economical platform for packaging rack-mount CompactPCI applications. The chassis will accept 3U or 6U cards mounted vertically or horizontally. Engineered for cooling the chassis system is available with either bottom to top or front to rear airflow.Technical Specifications # Aluminum sub-rack and panels chromate surfaces.# Rapid assembly.# EMC construction and EMC panels.# (1U~13U) (H) x 84T (W) x 285 (D) m / m.# Easy access to internal installations.# Meet IEEE1101.10 and compact PCI standard.# ISO 9001 certified. emc front panels, front cross rail, extrusion machine, rear cross rail, center cross rail, guide cross rail, front flange, rear flange, tapped strip, insulation strip, Hedif Technology
المزيد من الروابط

  • HECO-TECH ENTERPRISE CO., LTD.
  • HECTOS LTD.
  • HEDIF TECHNOLOGY CO., LTD.
  • HEDO INDUSTRY CORP.
  • HEEDFUL INTERNATIONAL CO., LTD.

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